ʻO ka hana mua i ke kaʻina hana o ka loaʻa ʻana o kahi chip paha ka patch; Aia i loko o ka TO kahi ʻāpana e hoʻomoe ana i ka wela i ke kumu TO, kahi puʻupuʻu e LD i ka wela wela, a me ke kukui hope PD;
He ʻokoʻa loa paha ke kaʻina hana kau ʻana: ʻo ka mea e hoʻopili ʻia he pahu LD / PD, a i ʻole TIA, resistor / capacitor; hiki ke hoʻokomo ʻia ma kahi alumini nitride heat sink a i ʻole pololei ma ka PCB; hiki ke hoʻohana i ka hoʻokomo Eutectic welding a i ʻole conductive adhesive; hiki i ka patch ke koi wale i nā ʻumi a i ʻole nā haneli microns o ka pololei, e like me TIA, nā mea pale, a me ka pololei sub-micron, e like me ka passive flip-chip welding.
Ma hope o ka ʻōlelo ʻana i kēia mau mea, he aha ke ʻano o ka patch? ʻAʻohe mea i ʻike ʻia he wehewehe maʻamau. Eia nō naʻe, hiki ke ʻike ʻia mai nā hiʻohiʻona ma luna aʻe he mea like lākou: hoʻohana ʻia ka hāmeʻa e kau a hoʻoponopono i ke kino kau ma luna o ka mea lawe me ka pololei e hoʻokō i kahi hana kikoʻī. (No ke aha e hoʻohana ai i nā mea hana? Manaʻo wau ua kapa ʻia ke kaʻina hoʻokomo i hiki ke hoʻomaʻamaʻa ʻia he patch, inā ʻaʻole hiki ke kapa ʻia ʻo ka hoʻopaʻa lima lima wale nō.) Ma muli o kēia manaʻo maʻamau, ua hōʻuluʻulu au i ʻehā mau mea nui o kahi pā: ke kino hoʻokomo, ka lawe lawe , Keʻano paʻa, pololei. A he aha ka mea lawe i hoʻohana ʻia, he aha ka solder i koho ʻia, a he aha nā koi kūpono, e hilinaʻi nui ia i ka hana e pono ai ka mea e kau ʻia.
Eia ka nānā ʻana i nā mea like ʻole i loko o nā mea ʻehā o ka patch.
ʻO ka hapa nui o nā mauna he mau pahu LD a me PD.
TIA / Keaukaha / Resistor / Capacitors, e like me nā kino hoʻokomo ʻaʻole koi i ka pololei kiʻekiʻe, hiki ke hoʻololi lima ʻia ma kahi o nā puke nui.
ʻO ka mea lawe maʻamau ʻo AIN heat sink; me ka hoʻomohala ʻana i nā ʻāpana i hoʻohui ʻia, ua lilo hoʻi nā ʻāpana PLC a me nā ʻāpana optical silicon i nā kino kau maʻamau, e like me ke kukui silicon grating coupling chips, kahi e pono ai ke kau ʻia ʻo LaMP ma luna o nā chips optical chips; ʻO ka PCB nā mea lawe maʻamau i nā pūʻolo COB, e like me ke kamaʻilio ʻikepili 100G-SR4 modules, PD / VSCEL i kau pololei ʻia ma ka PCB.
ʻO Au80Sn20 alloy he LD-mauna eutectic solder maʻamau. Hoʻohana pinepine ʻia ka conductive adhesive e kau i ka PD. ʻOi aku ka maikaʻi o ka lens paʻa paʻa UV.
ʻO ka pololei ma muli o ka noi kikoʻī;
Ma kahi e pono ai ka hoʻopili ʻana i ke ala optical, ʻoi aku ka kiʻekiʻe o ke koi pololei.
Pono ka pololei ʻoi aku ka pololei ma mua o ka hoʻohui ʻana.
Pono ka hoʻokomo LD i ka pololei ma mua o ka hoʻokomo PD,
ʻAʻole pono ʻo TIA / resistor / capacitor i kahi kikoʻī, e hoʻopili wale.
Kaʻina hoʻokomo maʻamau
Pākuʻi solder eutectic gula-tin
Pākuʻi hoʻopololei
Ma kahi ʻaʻole kiʻekiʻe ka pololei, pono ʻoe e nānā i lalo i ka CCD e kiʻi i nā kiʻi o ka chip a me ka substrate i ka manawa like, a hoʻohana i nā kaha alignment a i ʻole nā ʻaoʻao chip e align.
No nā noi flip-chip, koi ʻia nā CCD he nui, e nānā ana i ka lalo o ka chip a me ka ʻili o ka substrate. Pono pū nā noi kiʻekiʻe i nā kaha alignment kūikawā.
