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The first step in the process of receiving a chip may be the patch; a TO includes a patch that heat sinks to the TO socket, a chip that LDs to the heat sink, and a backlight PD; The specific mounting process may be very different: the object to be attached is usually an LD / PD chip, or TIA, resi...

In the optical communication industry, optical modules are the most exposed. They have different physical sizes, and the number of channels and transmission rates vary greatly. How these modules are produced, what are their characteristics, and all the secrets are in the standard. Older packaging...

Introduction of various PON systems 1. APON technology In the mid-1990s, some major network operators established the Full Service Access Network Alliance (FSAN), whose purpose is to formulate a unified standard for PON equipment so that equipment manufacturers and operators can enter the PON eq...

With the development of modern cities towards multi-functionalization, the urban layout is becoming more and more complex, and there are hundreds, hundreds, or even thousands of ground monitoring points. To ensure that functional departments can grasp real-time, clear and high-quality video image...

Lead: 100G Ethernet from research to commercial, need to solve the key technologies of interface, packaging, transmission, key components, etc. The key technologies of the current 100G Ethernet interface include physical layer, channel convergence technology, multi-fiber channel and wave Sub-mult...

1.Basic structure of PON PON (Passive Optical Network) PON is a single-fiber bidirectional optical access network using a point-to-multipoint (P2MP) structure. The PON system is composed of an optical line terminal (OLT), an optical distribution network (ODN), and an optical network unit (ONU) on...