Nhanho yekutanga mukugamuchira chip inogona kunge iri chigamba; a TO inosanganisira chigamba chinopisa chinonyura kune TO socket, chip iyo LDs kune inopisa sink, uye backlight PD;
Iyo chaiyo yekumisikidza maitiro anogona kunge akasiyana zvakanyanya: chinhu chinosungirirwa chinowanzo LD / PD chip, kana TIA, resistor / capacitor; kuiswa kunogona kuitwa pane aluminium nitride heat sink kana zvakananga paPCB; iyo yekuisa Eutectic welding kana conductive adhesive inogona kushandiswa; chigamba chinogona kungoda makumi kana kunyange mazana emamicrons echokwadi, akadai seTIA, resistors, uye sub-micron kunyatsoita, senge passive flip-chip welding.
Tataura zvese izvi, chii chaizvo chigamba? Hapana pazvinomboita seine tsananguro yakamisikidzwa. Zvisinei, zvinogona kuonekwa kubva mumienzaniso iri pamusoro apa kuti vane chinhu chimwe chete chakafanana: chigadziro chinoshandiswa kuisa uye kugadzirisa muviri wekuisa pamutakuri nehumwe huroyi kuti uwane basa rakananga. (Sei kushandisa midziyo? Ndinofunga kuti nzira yekuisa iyo inogona kuve yega inonzi chigamba, kana zvisina kudaro inogona kungonzi manual bonding.) Kubva pane iyi pfungwa yakajairika, ndapfupisa zvinhu zvina zvakakosha zvechigamba: mutumbi wekuisa, the mutakuri , Fixed nzira, kururama. Uye chii chinotakura chinoshandiswa, chii chinotengeswa chinosarudzwa, uye chii chakarurama chinodiwa, zvinoenderana zvachose nebasa iro chinhu chinosungirirwa chinoda kubudirira.
Heano kutarisa kune akasiyana mikana iri muzvikamu zvina zvechigamba:
Mazhinji emamongi ndeye LD uye PD machipisi.
TIA / Driver / Resistor / Capacitors, senge miviri yekuisa iyo isingade kurongeka kwepamusoro, inogona kutsiviwa nemaoko panzvimbo yemavhoriyamu makuru.
Mutakuri wechinyakare ndiye AIN kupisa sink; nekuvandudzwa kwemachipisi akabatanidzwa, PLC machipisi uye silicon optical machipisi avewo akajairika mitumbi inokwira, senge silicon light grating coupling chips, izvo zvinoda kuti LaMP iiswe pasilicon optical chips; PCB ndeye Yakajairwa vatakuri mumapakeji eCOB, senge data kutaurirana 100G-SR4 modules, PD / VSCEL inoiswa zvakananga paPCB.
Au80Sn20 alloy yakajairika LD-gomo eutectic solder. Conductive adhesive inowanzoshandiswa kuisa PD. UV glue yakagadziriswa lens inonyanya kukodzera.
Kururama kunobva pane chaiyo application;
Iko kunobatanidza nzira yekuona kunodiwa, iko kudiwa kwechokwadi kwakanyanya.
Passive alignment inoda kurongeka kwepamusoro pane kubatanidzwa kunoshanda.
Kuiswa kweLD kunoda kurongeka kwepamusoro pane kuiswa kwePD,
TIA / resistor / capacitor haidi chero chaiyo, ingoinamatira.
General placement process
Goridhe-tin eutectic solder chigamba
Conductive paste chigamba
Apo kururamisa hakusi kwakakwirira, iwe unongoda kutarisa pasi paCCD kuti utore mifananidzo ye chip uye substrate panguva imwe chete, uye shandisa kurongeka kwemavara kana chip edges kuti ienderane.
Kune flip-chip applications, maCCD akawanda anodiwawo, achitarisa zvese zviri pasi pechip uye pamusoro peiyo substrate. Yepamusoro-chaiyo maapplication anodawo akakosha ekumisikidza mamaki.
