Ukuqulunqwa kweBOSA:
Inxalenye yokukhupha ukukhanya ibizwa ngokuba yi-TOSA;
Inxalenye efumana ukukhanya ibizwa ngokuba yiROSA;
Xa ababini bedibene, babizwa ngokuba yiBOSA.
Umbane ukuya kwi-Optical TOSA:
I-LD (i-Laser Diode) i-semiconductor laser, esetyenziselwa ukuguqula imiqondiso yombane ibe yimiqondiso yokukhanya ukuze isetyenziswe kwiitheminali zokukhanya.
Ukujonga kwiROSA yoMbane:
I-PD Photo Dioder photodiode, esetyenziselwa ukuguqula iimpawu zokukhanya zibe zangoku, ezithi ziguqulwe zibe ngumqondiso wombane ngokusebenzisa i-mutual impedance amplifier (TIA).
I-TOSA kunye ne-ROSA zinokusetyenziswa ngokwahlukeneyo njengemodyuli ye-LC ye-optical module kunye ne-SC optical module. Xa i-BOSA isetyenziswa, isetyenziswa ngokubanzi njengemodyuli ye-SC optical
Ukukhetha ngesayizi kusekwe kowona bungakanani bangoku kwaye unamava alandelayo:
Umngxuma we-10mil kunye ne-PAD ye-20mil ihambelana nombane we-0.5A kwi-wire 20mil, kunye ne-40mil umngxuma kunye ne-40mil PAD ihambelana nomsinga we-1A kwi-40mil wire. Xa imfuno yangoku iphezulu, ii-vias ezininzi zinokubekwa kwiindawo ezikufutshane ukwandisa umthamo wokuthwala. Iindleko zokomba zidla ngokubalelwa kwi-30% ukuya kwi-40% yeendleko zokwenziwa kwePCB.
Ukuqwalasela zombini iindleko kunye nomgangatho wesignali, kungcono ukhethe i-10/20mil (i-drilling / soldering pad) kwiibhodi ze-6-10. Kuxinaniso oluphezulu kunye neePCB ezinobungakanani obuncinci, ukomba oyi-8mil unokuzanywa. Ubungakanani obuncinci bokugaya kwenza kube nzima ukufezekisa inkqubo, i-drill bit kulula ukuphuka, kwaye iindleko zinyuka. Ngokubanzi, iifektri zebhodi zifuna ukuba kubizwe imali yokomba engaphantsi kwe-11.81mil.
Ukusuka kwimbono yoyilo, umngxuma odlulayo ubandakanya umngxuma ophakathi wokugaya kunye nephedi yesolder ejikelezileyo, emisela ubungakanani bomngxuma wokomba. Njengoko ubungakanani bomngxuma wokutyhutyha buncinci, i-parasitic capacitance incinci, nto leyo inceda ngakumbi kuzinzo lweempawu zesantya esiphezulu.
Kwangaxeshanye, ubukhulu bomngxuma wokutyhutyha bukhawulelwe yinkqubo yokomba kunye nenkqubo ye-electroplating; Umngxuma omncinci, ixesha elide lithatha, kwaye kulula ukutenxa kwindawo esembindini. Xa ubunzulu bokomba (ngokusebenzisa ubunzulu bomngxuma malunga ne-50mil) budlula amaxesha ama-6 ukuvuleka, akunakwenzeka ukuqinisekisa ukubethelwa kobhedu okufanayo kudonga lomngxuma. Ke ngoko, ubuncinci bedayamitha yokugrumba abavelisi bePCB abanokubonelela ngayo yi-8mil.
Oku ngasentla kumbono omfutshane we "Intshayelelo kwiiParameters eziPhambili zeBOSA - ngesayizi (I)", enokuthi isebenze njengesalathiso kumntu wonke. Inkampani yethu ineqela lobugcisa elomeleleyo kwaye inokubonelela ngeenkonzo zobugcisa kubathengi. Okwangoku, inkampani yethu ineemveliso ezahlukeneyo: ezikrelekrelewena, imodyuli yonxibelelwano yamehlo, imodyuli yefiber ebonakalayo, imodyuli ye-sfp optical,oltizixhobo, Ethernettshintshakunye nezinye izixhobo zenethiwekhi. Ukuba ufuna, unokufunda ngakumbi malunga nabo.
