Isinyathelo sokuqala kwinkqubo yokufumana i-chip inokuba yi-patch; i-TO ibandakanya i-patch etshisa ukushisa kwi-TO socket, i-chip ethi i-LD kwi-heat sink, kunye ne-backlight PD;
Inkqubo ethile yokunyusela inokwahluka kakhulu: into encanyathiselwa idla ngokuba yi-LD / PD chip, okanye i-TIA, i-resistor / capacitor; ukubekwa kunokwenziwa kwi-aluminiyam nitride ye-heat sink okanye ngokuthe ngqo kwi-PCB; indawo yokubeka i-Eutectic welding okanye i-adhesive conductive ingasetyenziswa; isiziba sinokufuna kuphela amashumi okanye amakhulu eemicron zokuchaneka, njenge-TIA, izixhasi, kunye nokuchaneka kwe-sub-micron, njenge-passive flip-chip welding.
Sendikuthethile konke oku, yintoni kanye kanye isiziba? Akuzange kubonakale kukho inkcazo emgangathweni. Nangona kunjalo, kunokubonwa kwimizekelo engentla ukuba banento enye: isixhobo sisetyenziselwa ukubeka kunye nokulungisa umzimba wokubeka kwi-carrier ngokuchaneka okuthile ukufezekisa umsebenzi othile. (Kutheni kusetyenziswe izixhobo? Ndicinga ukuba inkqubo yokubeka enokuthi yenziwe ngokuzenzekelayo ibizwa ngokuba yi-patch, ngaphandle koko inokubizwa ngokuba yi-manual bonding.) Ngokusekelwe kule ngongoma eqhelekileyo, ndishwankathele izinto ezine eziphambili zepatch: umzimba wokubeka, i umthwali , Indlela emiselweyo, ukuchaneka. Kwaye yintoni i-carrier esetyenzisiweyo, yiyiphi i-solder ekhethiweyo, kunye neziphi iimfuno zokuchaneka, kuxhomekeke ngokupheleleyo kumsebenzi okufuneka kufakwe into efunekayo ukufezekisa.
Nalu ujongo kwizinto ezahlukeneyo ezinokwenzeka eziqulethwe kwizinto ezine zepetshi:
Uninzi lwezinyusi zi-LD kunye neechips zePD.
I-TIA / Umqhubi / I-Resistor / Capacitors, njengemizimba yokubeka engafuni ukuchaneka okuphezulu, inokutshintshwa ngesandla endaweni yemithamo emikhulu.
Esona sithwali semveli yi-AIN yokucima ubushushu; ngophuhliso lweetshiphusi ezidityanisiweyo, iitshiphusi ze-PLC kunye ne-silicon optical chips nazo ziye zaba yimizimba eqhelekileyo yokukhwela, efana ne-silicon light grating coupling chips, ezifuna ukuba i-LaMP ifakwe kwi-silicon optical chips; I-PCB ngabathwali abaqhelekileyo kwiiphakheji ze-COB, ezifana nonxibelelwano lwedatha iimodyuli ze-100G-SR4, i-PD / VSCEL ifakwe ngokuthe ngqo kwi-PCB.
I-Au80Sn20 ingxubevange yinto eqhelekileyo ye-LD-mount eutectic solder. I-conductive adhesive isoloko isetyenziselwa ukunyusa i-PD. I-UV glue fixed lens ifanelekile ngakumbi.
Ukuchaneka kuxhomekeke kwisicelo esithile;
Apho kufuneka ukudibanisa indlela yokukhanya, imfuno yokuchaneka iphezulu kakhulu.
Ulungelelwaniso olungazenzisiyo lufuna ukuchaneka okuphezulu kunokudibanisa okusebenzayo.
Ukubekwa kwe-LD kufuna ukuchaneka okuphezulu kunokubekwa kwePD,
I-TIA / resistor / capacitor ayifuni nakuphi na ukuchaneka, yincamathisele nje.
Inkqubo yokubekwa ngokubanzi
Igolide-tin eutectic solder patch
Iphetshi yokuncamathela eqhubayo
Apho ukuchaneka kungabikho phezulu, kufuneka ujonge phantsi kuphela kwiCCD ukuze ubambe imifanekiso yechip kunye ne-substrate ngaxeshanye, kwaye usebenzise amanqaku okulungelelanisa okanye imiphetho ye-chip ukulungelelanisa.
Kwizicelo ze-flip-chip, iiCCD ezininzi nazo ziyafuneka, zijonge zombini ezantsi kwetshiphu kunye nomphezulu we-substrate. Izicelo ezichaneke kakhulu zikwafuna namanqaku akhethekileyo olungelelwaniso.
