Isinyathelo sokuqala enqubweni yokuthola i-chip singaba isichibi; i-TO ihlanganisa isichibi lapho ukushisa kucwila kusokhethi TO, i-chip leyo LDs kusinki ukushisa, kanye backlight PD;
Inqubo ethize yokufaka ingase yehluke kakhulu: into ezonamathiselwa ngokuvamile iyi-chip ye-LD / PD, noma i-TIA, i-resistor / capacitor; ukubekwa kungenziwa kusinki yokushisa ye-aluminium nitride noma ngqo ku-PCB; ukubekwa kwe-Eutectic welding noma i-adhesive conductive ingasetshenziswa; isichibi singadinga kuphela amashumi noma amakhulu ama-microns okunemba, njenge-TIA, izihlungi, nokunemba kwe-sub-micron, njenge-passive flip-chip welding.
Sengikushilo konke lokhu, siyini ngempela isichibi? Akukaze kubonakale kunencazelo emisiwe. Kodwa-ke, kungabonakala ezibonelweni ezingenhla ukuthi banento eyodwa abafana ngayo: idivayisi isetshenziselwa ukubeka nokulungisa umzimba wokubeka kumthwali ngokunemba okuthile ukuze kuzuzwe umsebenzi othile. (Kungani kufanele usebenzise okokusebenza? Ngicabanga ukuthi inqubo yokubeka engakwazi ukuzisebenzela ibizwa ngokuthi i-patch, ngaphandle kwalokho ingabizwa kuphela ngokuthi i-manual bonding.) Ngokusekelwe kuleli phuzu elivamile, ngifingqe izici ezine ezibalulekile zesichibi: indikimba yokubeka, i inkampani yenethiwekhi , Indlela elungisiwe, ukunemba. Futhi yisiphi isithwali esisetshenziswayo, iyiphi i-solder ekhethiwe, nokuthi yiziphi izidingo zokunemba, kuncike ngokuphelele emsebenzini okumele kufakwe kuwo udinga ukuwufeza.
Nakhu ukubheka amathuba ahlukahlukene aqukethwe ezintweni ezine zesichibi:
Iningi lama-mounts ama-LD nama-PD chips.
I-TIA / Driver / Resistor / Capacitor, njengemizimba yokubeka engadingi ukunemba okuphezulu, ingashintshwa ngesandla esikhundleni samavolumu amakhulu.
Isithwali sendabuko kunazo zonke yi-AIN heat sink; ngokuthuthukiswa kwama-chips ahlanganisiwe, ama-PLC chips nama-silicon optical chips nawo asephenduke imizimba evamile yokukhweza, njengama-chips okuhlanganisa ama-silicon light grating, adinga ukuthi i-LaMP ifakwe kuma-silicon optical chips; I-PCB izithwali ezivamile kumaphakheji we-COB, njengokuxhumana kwedatha amamojula we-100G-SR4, i-PD / VSCEL afakwe ngokuqondile ku-PCB.
I-Au80Sn20 ingxubevange iyisidayisi esivamile se-LD-mount eutectic. I-conductive adhesive ivame ukusetshenziselwa ukukhweza i-PD. I-UV glue fixed lens ifaneleka kakhulu.
Ukunemba kuncike ekusetshenzisweni okuthile;
Lapho kudingeka khona ukuhlanganisa indlela yokubona, isidingo sokunemba siphezulu uma kuqhathaniswa.
Ukuqondanisa okwenziwayo kudinga ukunemba okuphezulu kunokuhlanganisa okusebenzayo.
Ukubekwa kwe-LD kudinga ukunemba okuphezulu kunokubekwa kwe-PD,
I-TIA / resistor / capacitor ayidingi ukunemba, vele uyinamathisele.
Inqubo yokubeka evamile
I-Gold-tin eutectic solder patch
Ipheshi lokunamathisela le-conductive
Lapho ukunemba kungephezulu, udinga kuphela ukubheka phansi ku-CCD ukuze uthwebule izithombe ze-chip ne-substrate ngesikhathi esifanayo, futhi usebenzise izimpawu zokuqondisa noma iziphetho ze-chip ukuze uqondanise.
Kuzinhlelo zokusebenza ze-flip-chip, ama-CCD amaningi nawo ayadingeka, abheke kokubili phansi kwe-chip nangaphezulu kwe-substrate. Izinhlelo zokusebenza ezinembe kakhulu nazo zidinga amamaki okuqondanisa akhethekile.
